How Rheology Can Be Used To Reduce Waste And Improve Formula

The workshop

Register here

The workshop discusses the use of advanced rheological methods to improve the ink formula on and quality control for printed electronics based on the work funded by the EPSRC Centre for Innova ve Manufacture of Large Area Electronics (CIMLAE). It will discuss the bene ts of the rheological methods and how these could be used in industry. There is scope for direct involvement in future work to implement these methods into industry.

Why use rheology?

By using the rheology, it is possible to improve the formula on of inks, especially func onal materials where a high solids content is required, and to improve quality control. Taking a rheological pro le for an ink is both faster and requires less material than performing print trials. Being able to assess the print quality, based on that informa on, will reduce the cost of formula ng new inks and provide a quick and easy method for quality control. The rheology is also an independent parameter allowing it to account for changes in feed stock. The methods discussed can be implemented on many commercially available rheometers which are o en under used.

When and Where

Where: Ins tute of Mechanical Engineers One Birdcage Walk



When: 25th April 2017



Registra on & Hot Bu et Lunch

Posters & demos


“Welcome, introduc on to CIMLAE” – Dr L. Occhipin , EPSRC CIMLAE


“Prin ng and Coa ng – a complex ow process” – Prof. Tim Claypole, Swansea University

Where does shear and extension of the uid impact on the process and why we need rheology control


“Does rheology determine printability” – Dr. James Claypole, Swansea University

CIMLAE is establishing the rela onship between rheology and print quality for all volume prin ng process


“A paradigm shi in high speed rheometry” – Prof. Rhodri Williams/Dr. Alex Holder, Swansea University

How FT-CSPS can speed up the measurement and lead to in line process control


Networking Break

Posters & demos


“Printable semi-conductor sensors” – Prof. Krishna Persaud, Manchester University

Latest advances in the development of sensors based on changing printable semiconductor proper es could be essen al tools for the IoT and Smart packaging


“Flexo prin ng diodes & semiconductors” – Andrea Greenacre and Dr. J. Claypole, Swansea University

Preliminary results from a study of prin ng diodes using exo. This could be a rst move towards directly integra ng with high speed prin ng


“Evalua ng printed diode performance” – Dr. Abhay A Sagade, Cambridge University

The semiconductors work in the lab, how do we compare this with the performance of printed diodes


“Opportuni es to work with CIMLAE” – Dr. Chris Rider, Director, EPSRC CIMLAE


Networking Co ee

Posters & demos



Registra on

There is a £40+VAT fee for the event, this is to cover the cost of food
You can register for the event through EventBright link on the WCPC website

Alternatively, contact the WCPC using: Email: Phone: +44 1792 295634 We are seeking 15 minutes of your time to help us secure Government investment of £25m into the Chemistry and Materials sector. Digital technologies such as AI, automation and advanced data analysis are already revolutionising the productivity of businesses. We are working on a bid to secure funding to set up a North West…

+ Read More