How Rheology Can Be Used To Reduce Waste And Improve Formula

The workshop

Register here

The workshop discusses the use of advanced rheological methods to improve the ink formula on and quality control for printed electronics based on the work funded by the EPSRC Centre for Innova ve Manufacture of Large Area Electronics (CIMLAE). It will discuss the bene ts of the rheological methods and how these could be used in industry. There is scope for direct involvement in future work to implement these methods into industry.

Why use rheology?

By using the rheology, it is possible to improve the formula on of inks, especially func onal materials where a high solids content is required, and to improve quality control. Taking a rheological pro le for an ink is both faster and requires less material than performing print trials. Being able to assess the print quality, based on that informa on, will reduce the cost of formula ng new inks and provide a quick and easy method for quality control. The rheology is also an independent parameter allowing it to account for changes in feed stock. The methods discussed can be implemented on many commercially available rheometers which are o en under used.

When and Where

Where: Ins tute of Mechanical Engineers One Birdcage Walk

London

SW1H 9JJ

When: 25th April 2017

Agenda

12:30

Registra on & Hot Bu et Lunch

Posters & demos

13:30

“Welcome, introduc on to CIMLAE” – Dr L. Occhipin , EPSRC CIMLAE

13:45

“Prin ng and Coa ng – a complex ow process” – Prof. Tim Claypole, Swansea University

Where does shear and extension of the uid impact on the process and why we need rheology control

14:00

“Does rheology determine printability” – Dr. James Claypole, Swansea University

CIMLAE is establishing the rela onship between rheology and print quality for all volume prin ng process

14:30

“A paradigm shi in high speed rheometry” – Prof. Rhodri Williams/Dr. Alex Holder, Swansea University

How FT-CSPS can speed up the measurement and lead to in line process control

15:00

Networking Break

Posters & demos

15:30

“Printable semi-conductor sensors” – Prof. Krishna Persaud, Manchester University

Latest advances in the development of sensors based on changing printable semiconductor proper es could be essen al tools for the IoT and Smart packaging

16:00

“Flexo prin ng diodes & semiconductors” – Andrea Greenacre and Dr. J. Claypole, Swansea University

Preliminary results from a study of prin ng diodes using exo. This could be a rst move towards directly integra ng with high speed prin ng

16:30

“Evalua ng printed diode performance” – Dr. Abhay A Sagade, Cambridge University

The semiconductors work in the lab, how do we compare this with the performance of printed diodes

16:45

“Opportuni es to work with CIMLAE” – Dr. Chris Rider, Director, EPSRC CIMLAE

17:00

Networking Co ee

Posters & demos

17:30

Close

Registra on

There is a £40+VAT fee for the event, this is to cover the cost of food
You can register for the event through EventBright link on the WCPC website

www.wcpcswansea.com/events

Alternatively, contact the WCPC using: Email: info@wcpcswansea.com Phone: +44 1792 295634

From: Innovate UK Part of: Business enterprise, Research and development, and UK economic growth Published: 28 November 2017 Last updated: 29 November 2017, see all updates Competition with up to £19 million for innovation projects and £16 million for business-graduate partnerships now open to UK organisations. Aerial shot of spaghetti junction in Birmingham. Credit: UAV4 at…

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